发明名称 FINFET DEVICE AND METHOD OF MANUFACTURING SAME
摘要 A semiconductor device and method for fabricating a semiconductor device is disclosed. An exemplary semiconductor device includes a substrate including a fin structure including one or more fins disposed on the substrate. The semiconductor device further includes a dielectric layer disposed on a central portion of the fin structure and traversing each of the one or more fins. The semiconductor device further includes a work function metal disposed on the dielectric layer and traversing each of the one or more fins. The semiconductor device further includes a strained material disposed on the work function metal and interposed between each of the one or more fins. The semiconductor device further includes a signal metal disposed on the work function metal and on the strained material and traversing each of the one or more fins.
申请公布号 US2013092984(A1) 申请公布日期 2013.04.18
申请号 US201113272305 申请日期 2011.10.13
申请人 LIU CHI-WEN;WANG CHAO-HSIUNG;TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD. 发明人 LIU CHI-WEN;WANG CHAO-HSIUNG
分类号 H01L29/772;H01L21/336 主分类号 H01L29/772
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