发明名称 LIGHT EMISSION DIODE SUPPORT FRAME CONSTRUCTION, AND MANUFACTURING METHOD THEREOF (2)
摘要 <P>PROBLEM TO BE SOLVED: To provide a light emission diode support frame construction and a manufacturing method thereof capable of, by manufacturing the light emission diode support frame construction in a strip and forming a pre-cutting line, reducing a cutting cost during processing thereafter, and capable of performing a lighting test and quality confirmation in a manufacturing process. <P>SOLUTION: In the light emission diode support frame construction and a manufacturing method thereof (2), a metallic material is processed to be a strip material including a plurality of linse of metal frames where a metal layer is plated on a surface of one line respectively. A long synthetic resin sealing body is molded on the metal frame on which the metal layer is plated, and a hollow functional region which exposes electrode plates of the plurality of metal frames is provided on the synthetic resin sealing body. The synthetic resin sealing body is cut in an axial direction to form a pre-cutting line. Thus, a cost of cutting is reduced during subsequent processing, and a lighting test and quality confirmation can be performed in a manufacturing process. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013069904(A) 申请公布日期 2013.04.18
申请号 JP20110207866 申请日期 2011.09.22
申请人 FUSHENG INDUSTRIAL CO LTD 发明人 ZHU JIN-FENG;CHEN YUAN FU
分类号 H01L33/62 主分类号 H01L33/62
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