| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a substrate inspection device capable of detecting poor soldering accurately for a plurality of failure causes. <P>SOLUTION: After solder printing process, solder volume, solder shape, and solder print position are measured. After component mounting process, component shape and component mounting position are measured. A substrate inspection device determines the contact area of a determination target component by utilizing solder shape, solder print position, component shape and component mounting position, and calculates an evaluation value corresponding to the ratio of multiplication value of the contact area and the solder volume. The substrate inspection device determines whether or not there is a failure due to floating of a component for the determination target component, by comparing the evaluation value with a threshold. <P>COPYRIGHT: (C)2013,JPO&INPIT |
