PRIMER COMPOSITION FOR BONDING OF SEMICONDUCTOR-ENCAPSULATING EPOXY RESIN MOLDING COMPOUND AND SEMICONDUCTOR DEVICE

摘要

PURPOSE: A primer composition is provided to have excellent adhesion between an epoxy resin-molding material and a semiconductor device and to have excellent heat resistance and water resistance by a low temperature heating hardening for a short time. CONSTITUTION: A primer composition contains alkoxysilyl group-containing polyamideimide resin represented by chemical formula a; an epoxy resin with two epoxy groups in one molecule, represented by chemical formula 2; a hardening accelerator; and an organic solvent. The epoxy resin is a mixture of an epoxy resin with another n value in chemical formula 2. The content of the epoxy resin mixture is 70weight% or less; and n has an average molecular weight distribution of 1-3.