发明名称 Semiconductor device and process for production thereof
摘要 The semiconductor device of this invention has unit cells, each of which includes: a substrate; a drift layer on the substrate; a body region in the drift layer; a first doped region of a first conductivity type in the body region; a second doped region of the first conductivity type arranged adjacent to the body region and in a surface region of the drift layer; a third doped region of the first conductivity type arranged between two adjacent unit cells' second doped region of the first conductivity type and in the surface region of the drift layer to contact with the second doped region of the first conductivity type; a gate insulating film arranged to contact with the surface of the drift layer at least between the first and second doped regions of the first conductivity type; a gate electrode on the gate insulating film; and first and second ohmic electrodes. The dopant concentration of the third doped region of the first conductivity type is lower than that of the second doped region of the first conductivity type and equal to or higher than that of the drift layer.
申请公布号 US8421151(B2) 申请公布日期 2013.04.16
申请号 US201013387951 申请日期 2010.10.19
申请人 YAMASHITA KENYA;PANASONIC CORPORATION 发明人 YAMASHITA KENYA
分类号 H01L29/66;H01L21/04 主分类号 H01L29/66
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