| 摘要 |
A disk drive head stack assembly includes a laminar flexible printed circuit (FPC) having first and second conductive layers, with a dielectric layer between. An integrated circuit (IC) chip is mounted to the laminar FPC. The IC chip may have a first plurality of terminals closer to the first conductive layer than to the second conductive layer, and second plurality of terminals that is offset towards the second conductive layer relative to the first plurality of terminals. First and second pluralities of conductive bumps contact and connect conductive traces of the first and second conductive layers to the first and second plurality of terminals, respectively. An average height of the second plurality of conductive bumps may be greater than that of the first plurality of conductive bumps. The second plurality of conductive bumps is aligned with and passes through a plurality of openings through the dielectric layer.
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