发明名称 |
Laminating system, IC sheet, scroll of IC sheet, and method for manufacturing IC chip |
摘要 |
Thin film integrated circuits are peeled from a substrate and the peeled thin film integrated circuits are sealed, efficiently in order to improve manufacturing yields. The present invention provides laminating system comprising transporting means for transporting a substrate provided with a plurality of thin film integrated circuits; first peeling means for bonding first surfaces of the thin film integrated circuits to a first sheet member to peel the thin film integrated circuits from the substrate; second peeling means for bonding second surfaces of the thin film integrated circuits to a second sheet member to peel the thin film integrated circuits from the first sheet member; and sealing means for interposing the thin film integrated circuits between the second sheet member and a third sheet member to seal the thin film integrated circuit with the second sheet member and the third sheet member. |
申请公布号 |
KR101254277(B1) |
申请公布日期 |
2013.04.15 |
申请号 |
KR20077003362 |
申请日期 |
2005.07.28 |
申请人 |
|
发明人 |
|
分类号 |
B29C65/02;G06K19/07;G06K19/077 |
主分类号 |
B29C65/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|