| 摘要 |
<p>PURPOSE: A method for testing multichip stack packages is provided to measure testing electrodes in chip cubes in which a small number of substrates are used without changing a tape carrier. CONSTITUTION: One or more chip cubes(100) in which a small number of substrates are used are provided. A plurality of testing electrodes(130) are arranged on the surface of a top chip(110) of the chip cube. The chip cube is attached to an adhesive tape(252) with the testing electrodes. The adhesive tape is attached to an inner side of a hole(251) of a tape carrier(250). Filling materials are formed on the adhesive tape to completely fill gaps(120) between the stacked chips. The tape carrier is fixed to a wafer testing carrier.</p> |
