发明名称 PHOTOSENSITIVE ADHESIVE COMPOSITION, AND OBTAINED USING THE SAME, ADHESIVE FILM, ADHESIVE SHEET, SEMICONDUCTOR WAFER WITH ADHESIVE LAYER, SEMICONDUCTOR DEVICE AND ELECTRONIC PART
摘要 <p>A PHOTOSENSITIVE ADHESIVE COMPOSITION COMPRISING: (A) A POLYIMIDE HAVING A CARBOXYL GROUP AS A SIDE CHAIN, WHEREOF THE ACID VALUE IS 80 TO 180 MG/KOH; (B) A PHOTO-POLYMERIZABLE COMPOUND; AND (C) A PHOTOPOLYMERIZATION INITIATOR.</p>
申请公布号 MY148389(A) 申请公布日期 2013.04.15
申请号 MY2006PI03207 申请日期 2006.07.05
申请人 HITACHI CHEMICAL COMPANY, LTD. 发明人 TAKASHI KAWAMORI;TAKASHI MASUKO;SHIGEKI KATOGI;MASAAKI YASUDA
分类号 G03F7/004 主分类号 G03F7/004
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