发明名称 SYMMETRIC PLASMA PROCESS CHAMBER
摘要 PURPOSE: A symmetric plasma processing chamber is provided to offer electric, gas flow and thermal symmetry for controlling plasma uniform and to control gap between an upper electrode and a lower electrode. CONSTITUTION: A plasma processing unit(100) includes a chamber body(142) and a cover assembly(110) surrounding a processing region, a support pedestal arranged in a central region hydraulically sealed from the processing region, a lower electrode supported by the support pedestal, and a substrate support assembly(160) including a first actuation device configured to vertically move the lower electrode by a specific distance while being arranged in the central region.
申请公布号 KR20130037198(A) 申请公布日期 2013.04.15
申请号 KR20120114793 申请日期 2012.10.16
申请人 APPLIED MATERIALS, INC. 发明人 JAMES D. CARDUCCI;HAMID TAVASSOLI;AJIT BALAKRISHNA;ZHIGANG CHEN;ANDREW NGUYEN;DOUGLAS A. BUCHBERGER JR.;KARTIK RAMASWAMY;SHAHID RAUF;KENNETH S. COLLINS
分类号 H05H1/46;C23C16/505;H01L21/205 主分类号 H05H1/46
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