SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to improve processing yield by forming an inner sealing member inside an inner package and an outer sealing member outside the inner package with different modulus materials. CONSTITUTION: A semiconductor chip is sealed by an inner sealing member. An inner package(1000c) includes four semiconductor chips(100-1,100-2,100-3,100-4) laminated on an inner substrate(200). The inner package is mounted on an outer substrate(2000). An outer sealing member(3000) seals the inner package. The modulus of the inner sealing member is smaller than the modulus of the outer sealing member.