| 摘要 |
<p>The purpose of the present invention is to provide a curable composition that has a low linear coefficient of expansion and that can provide a tough cured product. The curable resin composition which is characterized by containing, as essential ingredients, (A) a silicide that has a molecular weight less than 1000 that contains at least two carbon-carbon double bonds, which are reactive with an SiH group, in each molecule, (B) a compound that contains at least two SiH groups in each molecule, (C) a hydrosilylation catalyst, (D) a silicone compound that has a molecular weight of 1000 or more and contains at least one carbon-carbon double bond, which is reactive with an SiH group, in each molecule, and (E) an inorganic filler.</p> |
