| 摘要 |
A microelectronic package 10 can include a substrate 20 having first and second surfaces 21, 22 and first and second apertures 26a, 26b extending therebetween, first and second microelectronic elements 30a, 30b each having a surface 31 facing the first surface, and terminals 25a exposed at the second surface in a central region 23 thereof. The apertures 26a, 26b can have first and second parallel axes 29a, 29b extending in directions of the lengths of the respective apertures. The central region 23 of the second surface 22 can be disposed between the first and second axes 29a, 29b. The terminals 725a can include a first set 715a disposed on a first side of a theoretical third axis 729c and a second set 715b disposed on a second side of the third axis opposite from the first side. The signal assignments of the first terminals 725a in the first set 715a can be a mirror image of the signal assignments of the first terminals in the second set 715b. |
