POWER MODULE SUBSTRATE WITH HEAT SINK, MANUFACTURING METHOD THEREOF, POWER MODULE WITH HEAT SINK, AND POWER MODULE SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To provide a power module substrate with a heat sink capable of suppressing warpage occurrence, a manufacturing method thereof, a power module with a heat sink, and a power module substrate.

SOLUTION: A power module substrate 10 with a heat sink comprises a power module substrate 11 in which a circuit layer 13 is formed on one surface of an insulating substrate 12 and a metal layer 14 is formed on the other surface, and a heat sink 17 which is jointed to the metal layer 14 side and cools the power module substrate 11. The metal layer 14 is directly jointed to the heat sink 17. A ratio B/A of thickness A of the circuit layer 13 to thickness B of the metal layer 14 is set in a range of 2.167≤B/A≤20.

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