发明名称 METHOD FOR FORMING PHOTORESIST PATTERN
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for forming a resist pattern capable of forming a negative pattern with high resolution. <P>SOLUTION: A method for forming a resist pattern includes the steps of: (1) forming a resist film by applying a resist composition containing a base component whose solubility to an alkali developing solution is increased by the action of an acid, a photo-base generator component and an acid generator component onto a support medium; (2) subjecting the resist film to exposure without subjecting the resist film to pre-baking; (3) baking after the step (2) and neutralizing a base generated from the photo-base generator component by the exposure and an acid derived from the acid feed component at an exposed portion of the resist film to increase the solubility to an alkali developing solution of the base component by the action of an acid derived from the acid feed component at an unexposed portion of the resist film; and (4) alkali-developing the resist film to form a negative resist pattern in which an unexposed part of the resist film is dissolved and removed. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013064775(A) 申请公布日期 2013.04.11
申请号 JP20110202030 申请日期 2011.09.15
申请人 TOKYO OHKA KOGYO CO LTD 发明人 YOKOYA JIRO;NAKAMURA TAKESHI;SHIMIZU HIROAKI;NITO TAKEHITO
分类号 G03F7/038;G03F7/004;G03F7/039;H01L21/027 主分类号 G03F7/038
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