| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a chemical application device capable of preventing a wafer from being broken in an EUV exposure device. <P>SOLUTION: A chemical application device 101 comprises: a chemical application unit 102 which applies a chemical on a principal face of a substrate; an inspection unit 104 which inspects an adhesion state of foreign matters to the entire rear surface of the substrate; and a control unit 114 which determines whether or not to carry the substrate outside as a non-defective product on the basis of an inspection result of the inspection unit 104. <P>COPYRIGHT: (C)2013,JPO&INPIT |
