发明名称 ELECTRONIC PACKAGING CONNECTOR AND METHODS FOR ITS PRODUCTION
摘要 A surface mount packaging connector includes an elastic conductor, an interconnect pad, and a conductive layer. The elastic conductor has a top surface. The interconnect pad is electrically coupled to the elastic conductor. The top surface of the elastic conductor is arranged away from the interconnect pad. The conductive layer is on the top surface of the elastic conductor. The conductive layer provides an increased electrically conductive surface area and may also be a solderable surface.
申请公布号 US2013087371(A1) 申请公布日期 2013.04.11
申请号 US201113270268 申请日期 2011.10.11
申请人 MEYER-BERG GEORG;INFINEON TECHNOLOGIES AG 发明人 MEYER-BERG GEORG
分类号 H05K1/09;H01R9/00;H05K1/11 主分类号 H05K1/09
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