发明名称 COPPER FOIL FOR FLEXIBLE PRINTED WIRING BOARD, MANUFACTURING METHOD OF THE SAME, AND FLEXIBLE PRINTED WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a copper foil for a flexible printed wiring board, a manufacturing method of the same, and a flexible printed wiring board, capable of preventing a skirt-like pattern profile in an etching process of CCL from occurring, and forming a circuit having a uniform circuit width. <P>SOLUTION: The copper foil for a flexible printed wiring board is applied with a nickel - cobalt alloy plating layer on a glossy face side of a copper foil. The ratio of an area occupied by a crystal grain having a (011) plane orientation of the nickel - cobalt alloy plating layer is 80% or higher. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065661(A) 申请公布日期 2013.04.11
申请号 JP20110202910 申请日期 2011.09.16
申请人 HITACHI CABLE LTD 发明人 ITO YASUYUKI
分类号 H05K1/09;B32B15/01;B32B15/08;C25D7/06;H05K3/24 主分类号 H05K1/09
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