发明名称 OPTICAL SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide an optical semiconductor device which is easily manufactured using a sealing sheet, is thin, and has low chromaticity angle dependency, a sheet for sealing an optical semiconductor element which is used in the optical semiconductor device, and a manufacturing method of the optical semiconductor device. <P>SOLUTION: A sheet for sealing an optical semiconductor element is formed by laminating a sealing resin layer 1 where the optical semiconductor element 3 can be buried and a wavelength conversion layer 2 containing optical wavelength conversion particles directly or indirectly. An optical semiconductor device is formed by placing and pressure-molding the sheet for sealing the optical semiconductor element so that the sealing resin layer faces an optical semiconductor element mounting substrate 4. The wavelength conversion layer exists on an upper part of a molded body where the optical semiconductor element is buried, but does not exist on a side surface. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065884(A) 申请公布日期 2013.04.11
申请号 JP20120271182 申请日期 2012.12.12
申请人 NITTO DENKO CORP 发明人 AKAZAWA MITSUHARU;KONDO TAKASHI;OZAKI TAKASHI
分类号 H01L33/54;H01L33/50;H01L33/56 主分类号 H01L33/54
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