发明名称 WIRING BOARD
摘要 <P>PROBLEM TO BE SOLVED: To provide a wiring board mounted with a magnetic material device in a state of high versatility and stable performance. <P>SOLUTION: In a wiring board 1, an MRAM3 is embedded in a predetermined flat plate-like substrate 2, and a peripheral component 4a is disposed on a top face 2a of the substrate 2 where the MRAM3 is embedded and a peripheral component 4b is disposed on a rear face 2b. More specifically, the wiring board 1 is disposed in a state where the MRAM3 embedded in the substrate 2 is sandwiched between the peripheral component 4a and the peripheral component 4b. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013065689(A) 申请公布日期 2013.04.11
申请号 JP20110203378 申请日期 2011.09.16
申请人 RICOH CO LTD 发明人 KOYA DAISUKE
分类号 H05K1/18;H01L23/12 主分类号 H05K1/18
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