| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a highly reliable die bonder capable of determining occurrence of deflection when a die is not broken. <P>SOLUTION: In a die bonder or a die bonding method of sucking a die by means of a collet, pushing up a dicing tape to which the die adheres, peeling off the die sucked by means of a collet from the dicing tape, mounting the die on a substrate and then bonding the die thus peeled off on the substrate, deflection of the die is determined from the fact that reduction in air leak flow due to the gap between the collet and the die at the time of push-up is smaller than that at the time of normal peeling by a predetermined amount. <P>COPYRIGHT: (C)2013,JPO&INPIT |
