| 摘要 |
<P>PROBLEM TO BE SOLVED: To secure the sufficient adhesive strength of thermal stencil paper with a small amount of coating, and to suppress a punching failure. <P>SOLUTION: The thermal stencil paper is constituted so that a thermoplastic resin film 1 is bonded to a porous support 3 via an adhesive 2 and a release agent layer 4 is further provided to the thermoplastic resin film 1. The porous support 3 is subjected to hydrophilic treatment prior to the bonding of the thermoplastic resin film 1. <P>COPYRIGHT: (C)2013,JPO&INPIT |
