| 摘要 |
<p>A circuit board is prepared such that at least two resin substrates (30,31,32) are laminated and bonded bythermocom- pression, a circuit pattern (301, 303, 311-315, 321-325) made of a resin composition containing a conductor material is formed on at least one of opposing surfaces of the substrates (30, 31, 32), a region of the substrate which corresponds to a specific portion of the circuit pattern (301, 303, 311-315, 321-325) is recessed, the specific portion of the circuit projects into the recess (302, 322) in accordance with plastic deformation of the substrates (30, 31, 32) and the circuit pattern (301, 303, 311-315, 321-325) which is caused by thermocompression bonding, and the specific portion of the circuit pattern (301, 303, 311-315, 321-325) constitutes an exposed portion. Multilayer or three-dimensional wiring can be easily achieved in the circuit board.</p> |
