| 摘要 |
<p>The present invention provides a Cu-Co-Si system alloy sheet, being suitable for use in a variety of electronic device components, in particular, having excellent uniform adhesive property for plate. The copper alloy sheet for electronic materials, contains 0.5 to 3.0 mass% Co, 0.1 to 1.0 mass% Si, the balance being Cu and unavoidable impurities, wherein an average grain size in the center part of the sheet thickness is 20 µm or less, and
the number of the crystal grain, being tangent to a surface of the sheet and having 45 µm or more of the length of major axis, is 5 or less in the area of 1 mm in a rolling direction.</p> |
