| 摘要 |
PURPOSE: A multilayer printed wiring board and a method for manufacturing the multilayer printed wiring board are provided to prevent the difference of thermal expansion generated at a protrusion part or the separation or crack due to corrosion including oxidation for improving the reliability of a conductor by preventing the metal cutting part of the lateral side of a substrate from being exposed through cutting a connecting subject connecting multiple metallic members to each metallic member with a drill before resin charging metallic cutting holes and cutting along the metallic cutting holes. CONSTITUTION: A multilayer printed wiring board(10) comprises a core substrate(30), which is having a metal member(20) inside, in which a first side(F) having a first conductor(34A) and a first through hole land(36A) and a second side having a second conductor(34B) and a second through hole land(36B) are formed. A second through hole(21β) of the metal member accommodates a capacitor component(80) inside. A first insulation layer(50A) of F surface is formed on the first conductor and first side of the core substrate. A conductor(58A) is formed on the first insulation layer. The conductor on the first insulation layer of the F surface, the first conductor, a through hole conductor(36), and an electrode of a capacitor component are connected with a via conducting subject(60A) penetrating the first insulation layer. The first insulation layer of the F surface is formed on the first side of the core substrate and the first conductor. A third insulation layer(150A) is formed at the upper layer of the first insulation layer of the F surface. A second insulation layer(50B) of a S surface is formed on a second conductor and a second surface of the conductor substrate. A fourth insulation layer(150B) of the upper layer is formed on the second insulation layer of the S surface. A solder resist layer(70A) of the F surface is formed on the third insulation layer of the F surface and A solder resist layer(70B) of the S surface is formed on the fourth insulation layer of the S surface. |
