发明名称 |
Integrated circuits on a wafer and method for separating integrated circuits on a wafer |
摘要 |
Integrated circuits (1) on a wafer comprise a wafer substrate (2) and a structure applied on a surface (4) of the wafer substrate (2). The structure forms a plurality of integrated circuits (1) formed on the wafer substrate (2) and the integrated circuits (1) are separated by saw lines (6, 7). The structure comprises a plurality of superposed layers (9a-9e) formed on the wafer substrate (2) and a top layer (10) formed on the superposed layers (9a-9e). The integrated circuit (1) on the wafer further comprise a plurality of alignment marks (3) intended for aligning a separating device (18) for separating the integrated circuits (1) on the wafer into individual integrated circuits (1) during a separation process, wherein the alignment marks (3) are formed from at least one of the superposed layers (9a-9e). |
申请公布号 |
US8415769(B2) |
申请公布日期 |
2013.04.09 |
申请号 |
US20080668482 |
申请日期 |
2008.07.10 |
申请人 |
SCHEUCHER HEIMO;ALBERMANN GUIDO;CECCARELLI DAVID;NXP B.V. |
发明人 |
SCHEUCHER HEIMO;ALBERMANN GUIDO;CECCARELLI DAVID |
分类号 |
H01L23/544;H01L21/78 |
主分类号 |
H01L23/544 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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