发明名称 RELAY PUNCHING MOLD AND METHOD OF PUNCHING USING RELAY PUNCHING MOLD
摘要 PURPOSE: A relay punching mold and a punching method using the relay punching mold are provided to form a fixing hole and a processing hole of a target object with a punching process and not a drill process, thereby preventing drill burrs generated by drilling. CONSTITUTION: A relay punching mold(100) comprises an upper mold(110) and a lower mold(120). The upper mold includes an upper press(111), a guide post(118), a punch(112), an elastic member(116), and an upper plate(117). The upper press is connected to the guide post, thereby moving vertically. The punch is fixed to the lower part of the upper press, thereby forming a fixing hole or a processing hole of the target objet. The elastic member adjusts a gap between the upper plate and the upper press. The upper plate includes a punch insertion hole and is connected to the lower part of the upper press by the elastic member. The lower mold includes a die(123), a lower plate(122), and a guide post hole(121). The lower plate is formed in the upper part of the die, thereby being supported. The guide post hole is formed on the upper part of the die, supports the lower plate, and inserts the guide post of the upper mold.
申请公布号 KR20130035710(A) 申请公布日期 2013.04.09
申请号 KR20110100193 申请日期 2011.09.30
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 SI, JUNG KUK
分类号 B21D28/26;B21D28/34;B26F1/14;B30B15/02 主分类号 B21D28/26
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