发明名称 Method of manufacturing a DMOS trench transistor
摘要 To attain a comparatively high breakdown voltage at a high avalanche strength and with the physical size simultaneously being as small as possible, the invention proposes constructing a transistor device in a semiconductor material region in which a first source/drain region is used as a source region and in which the source region has a comparatively reduced surface charge or surface charge density.
申请公布号 US8415219(B2) 申请公布日期 2013.04.09
申请号 US20060638612 申请日期 2006.12.13
申请人 HIRLER FRANZ;STRACK HELMUT;INFINEON TECHNOLOGIES AG 发明人 HIRLER FRANZ;STRACK HELMUT
分类号 H01L21/336;H01L29/08;H01L29/16;H01L29/165;H01L29/78 主分类号 H01L21/336
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