METHOD FOR FABRICATING SEMICONDUCTOER PACKAGE

摘要

PURPOSE: A method for manufacturing a semiconductor package is provided to prevent the generation of a void due to the vortex of filler. CONSTITUTION: A strip level substrate(100) including a unit substrate(C) is prepared. Silicon fiber(200) of a matrix type is formed on the strip level substrate. The silicon fiber includes a first and a second pattern(210,230). A semiconductor chip(30) is bonded to the unit substrate. Filler is filled in a gap between the unit substrate and the semiconductor chip. [Reference numerals] (AA) Upper side; (BB) Lower side;