METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A method for manufacturing a semiconductor device is provided to improve productivity by attaching a semiconductor chip to a thermosetting resin to bury the semiconductor chip. CONSTITUTION: A semiconductor chip(5) with a conductive member(6) on a first main surface(5a) is prepared. A support structure(10) is formed by laminating a radiation curable adhesive layer(3) and a first thermosetting resin layer on a supporter(4). A plurality of semiconductor chips are arranged on the first thermosetting resin layer to make the first thermosetting resin layer face a second main surface(5b) which is opposite to the first main surface of the semiconductor chip. A second thermosetting resin layer(2) is laminated on the first thermosetting resin layer to cover the plurality of semiconductor chips. The radiation curable adhesive layer is cured by irradiating radiation from the supporter. The radiation curable adhesive layer is separated from the first thermosetting resin layer.