| 摘要 |
PURPOSE: A light emitting diode package and a method for manufacturing the same are provided to supply a SiC substrate which has a light conversion layer and acts as a fluorescent layer, by doping fluorescent elements in the SiC substrate in a growing process. CONSTITUTION: A semiconductor structure(120) is formed on a substrate(110). The semiconductor structure includes a first type semiconductor layer(122), a second type semiconductor layer(126), and an active layer(124). The substrate includes light conversion layers(112,114,116) having doped fluorescent elements. The light conversion layer partly absorbs the first light emitted from the active layer and converts the first light into the second light. The wavelength of the second light is longer than the wavelength of the first light. A sub-mount(200) includes a sub-substrate(210), a first electrode pad(222), and a second electrode pad(224).
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