发明名称 METHOD FOR PRODUCING A SOLDER JOINT
摘要 The invention relates to a method for producing a solder joint between at least one base part (2) and at least one first component (3), comprising the following steps: providing the base part (2); partially blasting a surface of the base part (2) using a SACO blasting agent, the blasting material (50) of which has a silicate coating (52), in such a way that a SACO-blasted region (20) and a non-blasted positioning region (40) are present; and soldering the at least first component (3) onto the non-blasted positioning region (40), wherein the SACO-blasted region (20) acts as a solder resist.
申请公布号 WO2013045348(A1) 申请公布日期 2013.04.04
申请号 WO2012EP68577 申请日期 2012.09.20
申请人 ROBERT BOSCH GMBH;MICHELS, DANIEL;GREEN, SIMON 发明人 MICHELS, DANIEL;GREEN, SIMON
分类号 H01L23/495;B24C1/00;H01L21/48;H01L23/31 主分类号 H01L23/495
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