| 摘要 |
<P>PROBLEM TO BE SOLVED: To suppress increase in cost and a circuit area when applicable processes are different between a semiconductor device and a printed board. <P>SOLUTION: A semiconductor device 1 includes a plurality of rear face electrodes 10 regularly disposed on the bottom face thereof. A plurality of first rear face electrodes 10a are provided at points corresponding to a plurality of first grid points 30a on the outermost periphery of the semiconductor device 1, among virtual grid points disposed in a matrix shape of M rows and N columns (M, N are integers of 4 or greater). A plurality of second rear face electrodes 10b are disposed at positions corresponding to a plurality of second grid points obtained by thinning out a plurality of grid points from grid points of (M-2) rows and (N-2) columns excluding the outermost periphery. <P>COPYRIGHT: (C)2013,JPO&INPIT |
