| 摘要 |
The present invention relates to a component (BE) which has a first duplexer operating with acoustic waves and a second duplexer operating with acoustic waves, wherein the first and second duplexers are arranged in a single SMD housing. In addition, the invention relates to a module (MO), which interconnects such a component (BE) and at least three 90° hybrids (HYB1-HYB3) to form an enhanced duplexer. A further aspect of the invention relates to a 2in1 hybrid, in which two 90° hybrids (HYB3, HYB4) or one 90° hybrid (HYB3) and one 180° hybrid (BAL) are arranged on a single chip.
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