发明名称 |
WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME |
摘要 |
Embodiments of the present invention provide a wiring substrate which is excellent in terms of the reliability of connection between the wiring substrate and a semiconductor chip. In some embodiments the wiring substrate comprises a first build-up layer in which resin insulation layers and conductor layers are laminated alternately. The outermost conductor layer can include a plurality of connection terminal portions to which a semiconductor chip is flip-chip connected. The plurality of connection terminal portions can be exposed through openings of a solder resist layer. Each of the connection terminal portions includes a connection region to which a connection terminal of the semiconductor chip is to be connected, and a wiring region which extends in a planar direction from the connection region and which is narrower than the connection region. The surface of the wiring region has a solder wettability lower than that of the surface of the connection region. |
申请公布号 |
US2013081862(A1) |
申请公布日期 |
2013.04.04 |
申请号 |
US201213633421 |
申请日期 |
2012.10.02 |
申请人 |
NGK SPARK PLUG CO., LTD.;NGK SPARK PLUG CO., LTD. |
发明人 |
HAYASHI TAKAHIRO;MORI SEIJI;ITO TATSUYA |
分类号 |
H05K1/03;H05K1/09;H05K3/22 |
主分类号 |
H05K1/03 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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