| 摘要 |
A semiconductor package includes a die pad, at least one semiconductor die mounted on the die pad, a plurality of leads disposed along peripheral edges of the die pad, at least one connecting bar for supporting the die pad, a first power bar disposed on one side of the connecting bar, a second power bar disposed on the other side of the connecting bar, and a connection member traversing the connecting bar and electrically connecting the first power bar with the second power bar.
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