发明名称 LIGHT-EMITTING DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting device in which peeling between a lead frame and a sealing resin is suppressed to improve reliability. <P>SOLUTION: A light-emitting device comprises: a first lead; a light-emitting device; a second lead; and a molding. The first lead has the light-emitting element fixed thereto. The second lead is provided so as to be spaced from the first lead and electrically connected to an electrode of the light-emitting element via a metal wire. The molding is composed of a sealing resin covering the light-emitting element, an end of the first lead to which the light-emitting element is fixed, and an end of the second lead to which the metal wire is bonded. A first groove filled with the sealing resin is provided on a surface of the second lead between a first portion contacting an outer edge of the molding and a second portion to which the metal wire is bonded, so as to cross a direction from the first portion toward the second portion. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013062338(A) 申请公布日期 2013.04.04
申请号 JP20110199048 申请日期 2011.09.13
申请人 TOSHIBA CORP 发明人 TAKESHITA ATSUSHI;IKEDO YUICHI;MURANAKA TETSUYA
分类号 H01L33/62;H01L33/52 主分类号 H01L33/62
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