| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor device which allows an attachment plate to be more firmly attached to a control board part. <P>SOLUTION: An attachment plate 5 is fixed to a print circuit board 2 such that sandwiching spring washers 9 are arranged between a land 3 on one surface of the print circuit board 2 of a control board part CB and the attachment plate 5, in a manner that each spring washer 9 is sandwiched with a flat washer 8a and a flat washer 8b, and screws 6 are inserted from another surface of the print circuit board 2 into substrate through holes 2a penetrating the print circuit board 2, the flat washers 8a, the spring washers 9, and the flat washer 8b, respectively, and fastened to screw holes 5a formed in the attachment plate 5, respectively. <P>COPYRIGHT: (C)2013,JPO&INPIT |
