| 摘要 |
An LED package, a method for manufacturing the same, and a dish-shaped reflector used in the same are provided to suppress optical loss by reflecting light to an outside of a package body. A package body(10) has an internal space in an installation space of an LED chip(2). The internal space of the package body is opened toward a light emitting direction. A chip supporting member(20) is installed in the internal space of the package body. The chip supporting member is formed to support the LED chip. A dish-shaped reflector(40) is positioned in the chip supporting member. The dish-shaped reflector includes an opening(442) formed at a bottom thereof and an inclined lateral reflector(44) for surrounding a periphery of the LED chip. |
