| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor chip of less chip area and low cost, which is malfunction-resistant. <P>SOLUTION: When a semiconductor chip 1 is mounted on a package 3, 80 pads PA are connected to 80 terminals TA of the package 3. When the semiconductor chip 1 is mounted on a package 5, 100 pads PA, PB, and PC are connected to 100 terminals TA of the package 5. An internal circuit of the semiconductor chip 1 operates as a microcomputer 4 with 80 terminals when electrodes E1 and E2 are isolated, and operates as the microcomputer 4 with 100 terminals when the electrodes E1 and E2 are short-circuited by an end of a bonding wire W. Accordingly, a special pad for setting the number of terminals of the package is not needed. <P>COPYRIGHT: (C)2013,JPO&INPIT |
