发明名称 |
FOLDED TAPE PACKAGE FOR ELECTRONIC DEVICES |
摘要 |
Described herein is a folded tape package for electronic devices. The folded tape package uses a flexible tape substrate having two end sections for passive components and a middle section for connecting and stacking multiple dies. The stacked dies are encapsulated or covered with a mold. One side may be left exposed for device functionality and operation with additional components or devices. The passive components may also be covered with a mold. The end sections are folded such that the end sections are in a parallel configuration with the middle section. The flexible tape substrate may be a high density interconnect flexible tape substrate with two layers. A silicon substrate may be used to interconnect a die stack to the flexible tape substrate. The folded tape package has a reduced device footprint, lower substrate warpage effects, and higher substrate yields.
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申请公布号 |
US2013083239(A1) |
申请公布日期 |
2013.04.04 |
申请号 |
US201113248593 |
申请日期 |
2011.09.29 |
申请人 |
TAM SAMUEL;FLEXTRONICS AP, LLC |
发明人 |
TAM SAMUEL |
分类号 |
H04N5/225;H05K1/02;H05K3/00 |
主分类号 |
H04N5/225 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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