POLISHING LIQUID FOR POLISHING PROCESS BASED ON METAL CO AND USE THEREOF

摘要

Disclosed is a polishing liquid for a polishing process based on metal Co and the use thereof. The polishing liquid components comprise the following raw materials by weight percent: 0.01-2% of inhibitor, 0-5% of oxidant, 0.1-10% of grinding particle, 0.001-10% of chelating agent and the balance being water; the above raw materials are regulated by a pH-value regulating agent until the pH-value of the polishing liquid reaches 3-5; the inhibitor is selected from more than one of five-membered heterocyclic derivatives containing S or N or containing both S and N; the oxidant is selected from more than one of hydrogen peroxide, ammonium persulphate, potassium periodate and potassium perchlorate; the grinding particle is selected from more than one of silicon dioxide, cerium dioxide and aluminum oxide; and the chelating agent is selected from amino acid or citric acid or the mixture thereof. The polishing liquid of the present invention can effectively inhibit the static corrosion of the metal Co, reduce the polishing rate of the metal Co, and prevent the metal Co from over-corrosion during polishing.