| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a phenolic resin composition excellent in metal adhesivity and heat resistance of its cured material. <P>SOLUTION: The phenolic resin composition contains a phenolic resin and a disulfide compound, and the disulfide compound contains a compound represented by formula (1) and a compound represented by formula (2). R<SP POS="POST">1</SP>-S-S-R<SP POS="POST">2</SP>...(1) wherein R<SP POS="POST">1</SP>and R<SP POS="POST">2</SP>are hydrogen, or a 1-16C aliphatic group or an aromatic group having a hydroxyl group, a mercapto group, a carboxyl group, an amino group or an amide group, and may be identical or different. In formula (2), n is an integer of 1 to 6; R<SP POS="POST">3</SP>to R<SP POS="POST">8</SP>are hydrogen, a hydroxyl group, a mercapto group, a carboxyl group, an amino group or an amide group, or a 1-16C aliphatic group or an aromatic group having these substituents, and may be identical or different. <P>COPYRIGHT: (C)2013,JPO&INPIT |
