发明名称 MANUFACTURING METHOD OF ELECTRONIC DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To provide a laser sealing method capable of obtaining long-term reliability without providing a material which adsorbs a gas component into an organic EL device or the like. <P>SOLUTION: A method for manufacturing an electronic device via laser sealing comprises the steps of: (1) preparing a glass substrate; (2) manufacturing a sealing material paste by mixing a sealing material containing a glass powder and a vehicle containing an organic binder; (3) forming a coating layer by coating the glass substrate with the sealing material paste; (4) obtaining a glass substrate with a sealing material layer by firing the coating layer; (5) overlaying the glass substrate with a sealing material layer and a glass substrate on which no sealing material layer is formed via the sealing material layer; and (6) airtightly sealing the glass substrate with the sealing material layer and the glass substrate on which no sealing material layer is formed by irradiating the glass substrates with a laser beam so that a laser sealing temperature becomes a firing temperature or lower. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013062231(A) 申请公布日期 2013.04.04
申请号 JP20120140519 申请日期 2012.06.22
申请人 NIPPON ELECTRIC GLASS CO LTD 发明人 MASUDA NORIAKI;SHIRAGAMI TORU;ARAKAWA HIROSHI
分类号 H05B33/10;C03C8/24;C03C27/06;H01L51/50;H05B33/04 主分类号 H05B33/10
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