发明名称 |
MANUFACTURING METHOD OF ELECTRONIC DEVICE |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a laser sealing method capable of obtaining long-term reliability without providing a material which adsorbs a gas component into an organic EL device or the like. <P>SOLUTION: A method for manufacturing an electronic device via laser sealing comprises the steps of: (1) preparing a glass substrate; (2) manufacturing a sealing material paste by mixing a sealing material containing a glass powder and a vehicle containing an organic binder; (3) forming a coating layer by coating the glass substrate with the sealing material paste; (4) obtaining a glass substrate with a sealing material layer by firing the coating layer; (5) overlaying the glass substrate with a sealing material layer and a glass substrate on which no sealing material layer is formed via the sealing material layer; and (6) airtightly sealing the glass substrate with the sealing material layer and the glass substrate on which no sealing material layer is formed by irradiating the glass substrates with a laser beam so that a laser sealing temperature becomes a firing temperature or lower. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013062231(A) |
申请公布日期 |
2013.04.04 |
申请号 |
JP20120140519 |
申请日期 |
2012.06.22 |
申请人 |
NIPPON ELECTRIC GLASS CO LTD |
发明人 |
MASUDA NORIAKI;SHIRAGAMI TORU;ARAKAWA HIROSHI |
分类号 |
H05B33/10;C03C8/24;C03C27/06;H01L51/50;H05B33/04 |
主分类号 |
H05B33/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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