EMI SHIELDED SEMICONDUCTOR PACKAGE AND EMI SHIELDED SUBSTRATE MODULE

摘要

An EMI shielded semiconductor package includes a semiconductor package and an EMI shield layer formed on at least a part of a surface of the EMI shielded semiconductor package. The EMI shield layer includes a matrix layer; a metal layer positioned on the matrix layer; and a first seed particle positioned in an interface between the matrix layer and the metal layer. Unlike a conventional shielding process that is performed for a device level, a shielding process may be performed for a mounting substrate level, and thus the semiconductor package and the substrate module may be manufactured with high-productivity at low costs in a short period of time.