发明名称 |
PHOTOSENSITIVE RESIN COMPOSITION, CURED FILM THEREOF AND PRINTED CIRCUIT BOARD |
摘要 |
[Problems] The present invention relates to a photosensitive resin composition in which a cured film obtained therefrom has good resistance to electroless gold plating and occurrence of whitening phenomenon in a solder leveling process (pre-soldering process) and an electroless gold plating process is inhibited; a cured film of the photosensitive resin composition; and a printed circuit board comprising the cured film. [Means for Solution] The photosensitive resin composition is characterized by comprising (A) a non-photosensitive carboxylic acid resin, (B) an aluminum-containing inorganic filler and (C) an epoxy resin. It is preferred that the photosensitive resin composition further comprise a photosensitive monomer.
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申请公布号 |
US2013081858(A1) |
申请公布日期 |
2013.04.04 |
申请号 |
US201213630506 |
申请日期 |
2012.09.28 |
申请人 |
TAIYO INK MFG. CO. LTD.;TAIYO INK MFG. CO. LTD. |
发明人 |
NORIKOSHI AKIO;ARIMA MASAO |
分类号 |
G03F7/004;H05K1/00 |
主分类号 |
G03F7/004 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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