MOLDED RESIN BODY FOR SURFACE-MOUNTED LIGHT-EMITTING DEVICE, MANUFACTURING METHOD THEREOF, AND SURFACE-MOUNTED LIGHT-EMITTING DEVICE

摘要

This molded resin body for a surface-mounted light-emitting device comprises a cured resin body integrally formed with multiple leads and has a recessed section where the multiple leads are exposed at the bottom. The open face of the recessed section has a ten-point mean roughness (Rz) of 1µm-10µm, the cured resin body has a glass transition temperature equal to or higher than 10°C, and the glass transition temperature is a value which is measured by using a thermo-mechanical analyzer (TMA) under the conditions of a temperature range of -50 to 250°C, a heating rate of 5°C/min, and a specimen length of 1-5mm. The open face of the recessed section has an optical reflectance equal to or higher than 80% at 460nm, and the retention rate of the optical reflectance after the molded resin body is heated at 180°C for seventy-two hours is equal to or higher than 90%.