| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a polishing pad auxiliary plate having a novel structure that can raise the temperature of a polishing pad surface promptly with energy saving efficiency and can maintain a suitable temperature in a chemical mechanical polishing process, and to provide a polishing apparatus thereof. <P>SOLUTION: A polishing pad auxiliary plate 10 has a pad supporting surface for supporting a polishing pad 16 in an overlapped and adhered state to a surface 40 thereof, and has, at a backside surface 42 thereof, a mounting surface to be overlapped and removably mounted on a rotating surface plate 14. The plate includes an energizing type temperature control means 50 for raising the temperature of an auxiliary plate body 38 (pad supporting surface 40) and maintaining it at the suitable temperature by electrically energizing the auxiliary plate body. <P>COPYRIGHT: (C)2013,JPO&INPIT |
