发明名称 |
CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF, AND SILVER ALLOY SPUTTERING TARGET FOR FORMING CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a conductive film which has characteristics of low resistance and high reflectance and small surface roughness and also has high sulfur resistance and chlorine resistance, and a manufacturing method thereof. <P>SOLUTION: A conductive film contains Cu of 0.1 to 2.5 atom%, Sb of 0.1 to 1.5 atom%, and Ga of 0.5 to 3 atom%, and is constituted of a silver alloy having a component composition composed of the balance being Ag and unavoidable impurities. The conductive film is formed by laminating a transparent conductive film of an organic EL element on the surface thereof, and is suitable as a reflection electrode film for the organic EL element obtained by further laminating an electroluminescent layer containing an organic EL layer thereon. <P>COPYRIGHT: (C)2013,JPO&INPIT |
申请公布号 |
JP2013062203(A) |
申请公布日期 |
2013.04.04 |
申请号 |
JP20110201331 |
申请日期 |
2011.09.15 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
NONAKA SOHEI;KOMIYAMA SHOZO |
分类号 |
H05B33/26;C22C5/06;C22C5/08;C22F1/00;C22F1/14;H01L21/28;H01L21/285;H01L51/50;H05B33/28 |
主分类号 |
H05B33/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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