发明名称 PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF
摘要 <p>PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase matching capability in each position of a wiring board in an exposure process. CONSTITUTION: A wiring pattern(1) forms a wiring pattern by etching a metal layer. A print area(2-5) forms a plurality of alignment marks(11-16). Even if deformation or distortion is generated in each print area of a wiring plate, a matching error is measured in each print area(2-5). The alignment mark is simultaneously formed when the wiring pattern is formed in the print area.</p>
申请公布号 KR20130033165(A) 申请公布日期 2013.04.03
申请号 KR20110097079 申请日期 2011.09.26
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 MOK, JEE SOO
分类号 H05K3/12;G03F7/20;H05K3/24 主分类号 H05K3/12
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