发明名称 |
PRINTED CIRCUIT BOARD AND MANUFACTURING METHOD THEREOF |
摘要 |
<p>PURPOSE: A printed circuit board and a manufacturing method thereof are provided to increase matching capability in each position of a wiring board in an exposure process. CONSTITUTION: A wiring pattern(1) forms a wiring pattern by etching a metal layer. A print area(2-5) forms a plurality of alignment marks(11-16). Even if deformation or distortion is generated in each print area of a wiring plate, a matching error is measured in each print area(2-5). The alignment mark is simultaneously formed when the wiring pattern is formed in the print area.</p> |
申请公布号 |
KR20130033165(A) |
申请公布日期 |
2013.04.03 |
申请号 |
KR20110097079 |
申请日期 |
2011.09.26 |
申请人 |
SAMSUNG ELECTRO-MECHANICS CO., LTD. |
发明人 |
MOK, JEE SOO |
分类号 |
H05K3/12;G03F7/20;H05K3/24 |
主分类号 |
H05K3/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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